Power chips are linked to outside circuits with packaging, and their efficiency depends on the support of the product packaging. In high-power situations, power chips are generally packaged as power components. Chip interconnection refers to the electric connection on the upper surface of the chip, which is normally aluminum bonding cord in standard components. ^
Conventional power component plan cross-section
At present, commercial silicon carbide power components still mostly utilize the packaging innovation of this wire-bonded conventional silicon IGBT component. They encounter troubles such as big high-frequency parasitic criteria, inadequate warmth dissipation capability, low-temperature resistance, and insufficient insulation stamina, which limit making use of silicon carbide semiconductors. The screen of excellent efficiency. In order to fix these issues and completely make use of the big prospective advantages of silicon carbide chips, lots of brand-new packaging technologies and options for silicon carbide power components have actually arised in recent times.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually developed from gold cord bonding in 2001 to aluminum wire (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have developed from gold wires to copper wires, and the driving force is price reduction; high-power devices have actually created from light weight aluminum wires (strips) to Cu Clips, and the driving force is to enhance item efficiency. The greater the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that utilizes a strong copper bridge soldered to solder to attach chips and pins. Compared with conventional bonding product packaging techniques, Cu Clip modern technology has the complying with benefits:
1. The link between the chip and the pins is constructed from copper sheets, which, to a particular degree, changes the basic cable bonding approach in between the chip and the pins. Consequently, an unique package resistance worth, higher present circulation, and far better thermal conductivity can be acquired.
2. The lead pin welding area does not need to be silver-plated, which can fully save the price of silver plating and poor silver plating.
3. The product appearance is totally constant with normal items and is mainly utilized in servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power supplies, and other areas.
Cu Clip has 2 bonding techniques.
All copper sheet bonding technique
Both eviction pad and the Resource pad are clip-based. This bonding technique is more pricey and complex, but it can attain far better Rdson and better thermal results.
( copper strip)
Copper sheet plus cord bonding approach
The source pad makes use of a Clip method, and the Gate makes use of a Cord technique. This bonding technique is a little more affordable than the all-copper bonding approach, conserving wafer area (suitable to very tiny gate locations). The process is less complex than the all-copper bonding technique and can acquire far better Rdson and much better thermal effect.
Provider of Copper Strip
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